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ANSI X9.73-2017 Cryptographic Message Syntax ASN.1 XML
ANSI | Financial Industry

ANSI X9.73-2017: Cryptographic Message Syntax – ASN.1 and XML Standard

ByBrad Kelechava October 16, 2017June 5, 2025

ANSI X9.73-2017: Cryptographic Message Syntax – ASN.1 and XML, which was processed and approved for submittal to ANSI by the Accredited Standards Committee on Financial Services,…

Wrench and nuts with zinc hot-dip galvanized coatings tested to ASTM A123-17
ANSI | Metals and Mining

ASTM A123-17: Standard Specification for Zinc (Hot-Dip Galvanized) Coatings

ByBrad Kelechava October 12, 2017May 29, 2025

Steel and iron often earn their rust-resistance through galvanization, which involves coating the material in zinc. There are several alternatives for carrying this out, but hot-dip…

Container ship that has been tested by ASTM D4728-17 is sailing on water
ANSI | ASTM Testing

ASTM D4728-17: Standard Test Method for Random Vibration Testing of Shipping Containers

ByBrad Kelechava October 11, 2017May 29, 2025

ASTM D4728-17(2022): Standard Test Method for Random Vibration Testing of Shipping Containers has been released. ASTM Standards for Shipping Container Testing In continuous motion to their…

Suited up in HVSA, workers from OSHA explore wind farm and note top 10 violations related to fall protection.
ANSI | Occupational Health and Safety

OSHA Releases the Top 10 Violations of 2017

ByBrad Kelechava October 10, 2017May 29, 2025

The Occupational Safety and Health Administration (OSHA) has once again released its annual list of the top 10 cited violations. This list is the culmination…

The First Hardhat Industrial Head Protection ANSI
ANSI | Construction | Occupational Health and Safety | PPE and Body Protection

The First Hardhat

ByBrad Kelechava October 10, 2017May 29, 2025

 Our brain is the epicenter of our being, and yet industrial head protection is a concern unique to modern history. Prior to this time, safeguards…

Silicon Wafer for 3D Semiconductor Components
ANSI | Computer Science

3D Semiconductor Components: Design and Assembly Process Implementation

ByBrad Kelechava October 6, 2017May 29, 2025

Three-dimensional (3D) semiconductor components designed through monolithic, or sequential, fabrication—the process of vertically stacking two or more semiconductors for wire-bond assembly—present new options for computer…

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